SCOTTSDALE, Arizona, March 17 /PRNewswire/ --

- General Forum Meeting, WLCSP Specific Tracks and Papers to be Presented

The WLCSP Forum today announced a general meeting to be held at the Radisson Fort McDowell Resort and Casino in Scottsdale, Arizona, on Tuesday, March 18, 2008, at IMAPS' 4th Annual International Conference and Exhibition on Device Packaging, March 17 through 20, 2008. The WLCSP Forum is also hosting two WLCSP specific tracks, featuring numerous technical papers and panel discussions.

The WLCSP Forum's objectives are to promote the adoption of semiconductor devices using Wafer Level Chip Scale Packages (WLCSP), to establish industry sponsored "best practices" for their utilization and to establish strategies for migration to finer pitch WLCSP products. Members include industry leaders such as Amkor, California Micro Devices, Cypress, Fairchild, FlipChip, Infineon, Lord, Maxim, Nokia, Pac Tech, STMicroelectronics, Umicore and Volterra.

WLCSP Forum General Meeting

The WLCSP Forum will hold an open meeting on March 18, 2008, at 8 PM. The purpose of this meeting is to inform potential new members about the benefits of joining the organization, and to answer any questions or concerns. All those interested are invited free of charge. If you would like to attend this meeting, contact Richard Haas, info@wlcspforum.org.

International Conference and Exhibition on Device Packaging in Scottsdale

The WLCSP Forum will present two tracks on CSP reliability and manufacturing issues all day on Tuesday, March 18 at the IMAPS event. Ted Tessier, chief technical officer of FlipChip International, and a WLCSP Forum Board Member, will host these sessions. Go to: http://www.imaps.org/devicepackaging.

Other International Events Planned

The WLCSP Forum will be presenting papers, and will have a booth presence at the upcoming 2nd Electronic System-Integration Technology Conference (ESTC) in Greenwich, London, UK, on September 1-4, 2008, and at the IWLCP Conference and Exhibition in San Jose, California, on October 15-16, 2008. More information at: http://www.wlcspforum.org.

About the WLCSP Forum

The Wafer Level Chip Scale Packaging Forum is a California, non profit, mutual benefit corporation focused on promoting the adoption of WLCSP semiconductor devices. Detailed information may be accessed at http://www.wlcspforum.org.

All trademarks are property of their respective owners.

Web site: http://www.wlcspforum.org

Richard Haas of The WLCSP Forum, +1-408-934-3108, info@wlcspforum.org